1 6

TechDrip Canada

M.Y Board Transfer Reballing Stencil (A18 / A18 pro) & Middle Layer Frame Reballing Platform For iPhone 16 series (M.Y)

M.Y Board Transfer Reballing Stencil (A18 / A18 pro) & Middle Layer Frame Reballing Platform For iPhone 16 series (M.Y)

$30.09 CAD
$30.09 CAD
Sale Sold out
Shipping calculated at checkout.
  • The M.Y Board Transfer Reballing Stencil (A18 / A18 Pro) is specially designed for iPhone 16 series motherboard repair work.
  • It allows precise and accurate reballing of A18 and A18 Pro chipset components.
  • Made from high-quality metal material for durability and heat resistance.
  • Ensures stable positioning during solder ball placement for professional results.
  • The Middle Layer Frame Reballing Platform provides strong support during board transfer operations.
  • It helps maintain alignment of delicate motherboard layers during repair.
  • Designed for high-precision microsoldering and IC repair work.
  • Ideal for professional mobile repair technicians and advanced repair labs.
  • Compatible with iPhone 16 series board-level repair processes.
  • A complete M.Y solution for accurate, safe, and efficient reballing operations.
View full details