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MFix-16 Series Mbga Motherboard Middle Layer BGA Reballing Platform For iPhone 16 Series (Amaoe)

MFix-16 Series Mbga Motherboard Middle Layer BGA Reballing Platform For iPhone 16 Series (Amaoe)

Regular price $177.26 CAD
Regular price Sale price $177.26 CAD
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  • The MFix-16 Series MBGA Motherboard Middle Layer BGA Reballing Platform by Amaoe is designed for iPhone 16 series repair work.
  • It is used for precise motherboard alignment and BGA reballing operations.
  • Provides strong and stable support for middle layer board positioning during repair.
  • Made from high-quality, durable materials for long-lasting professional use.
  • Ensures accurate chip alignment for safe and efficient microsoldering work.
  • Helps reduce the risk of damage during complex motherboard repair processes.
  • Compatible with advanced iPhone 16 series board-level repair tasks.
  • Designed to improve precision and efficiency in reballing operations.
  • Ideal for professional mobile repair technicians and service centers.
  • A reliable Amaoe tool for high-accuracy iPhone 16 series motherboard repairs.
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