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TechDrip Canada
MFix-16 Series Mbga Motherboard Middle Layer BGA Reballing Platform For iPhone 16 Series (Amaoe)
MFix-16 Series Mbga Motherboard Middle Layer BGA Reballing Platform For iPhone 16 Series (Amaoe)
Regular price
$177.26 CAD
Regular price
Sale price
$177.26 CAD
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- The MFix-16 Series MBGA Motherboard Middle Layer BGA Reballing Platform by Amaoe is designed for iPhone 16 series repair work.
- It is used for precise motherboard alignment and BGA reballing operations.
- Provides strong and stable support for middle layer board positioning during repair.
- Made from high-quality, durable materials for long-lasting professional use.
- Ensures accurate chip alignment for safe and efficient microsoldering work.
- Helps reduce the risk of damage during complex motherboard repair processes.
- Compatible with advanced iPhone 16 series board-level repair tasks.
- Designed to improve precision and efficiency in reballing operations.
- Ideal for professional mobile repair technicians and service centers.
- A reliable Amaoe tool for high-accuracy iPhone 16 series motherboard repairs.
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