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TechDrip Canada

Mid-layer General-purpose Tin Planting Platform For iPhone 16 Series (YCS)

Mid-layer General-purpose Tin Planting Platform For iPhone 16 Series (YCS)

$41.25 CAD
$41.25 CAD
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  • Mid-layer solder mesh designed for precise reballing of iPhone 16 Pro and 16 Pro Max multilayer logic boards
  • Restores damaged or missing solder points across internal board layers
  • Ensures accurate alignment during reconstruction of middle-layer solder pads
  • Ideal for repairing CPU, PMIC and complex IC modules in the iPhone 16 Pro series
  • High-temperature resistant mesh optimized for professional microsoldering environments
  • YCS mesh engineered for consistent accuracy in advanced board-level rework
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