1 9

TechDrip Canada

Mid-layer General-purpose Tin Planting Platform For iPhone 17 Series (YCS)

Mid-layer General-purpose Tin Planting Platform For iPhone 17 Series (YCS)

$41.25 CAD
$41.25 CAD
Sale Sold out
Shipping calculated at checkout.
  • Mid-layer solder mesh designed for accurate reballing of iPhone 17, 17 Pro and 17 Pro Max multilayer boards
  • Ensures precise restoration of solder points across middle layers during board-level repair
  • Improves alignment and consistency when rebuilding damaged or missing solder pads
  • Ideal for CPU, PMIC and multilayer IC repair on iPhone 17 series logic boards
  • High-temperature resistant mesh compatible with professional microsoldering workflows
  • YCS mesh optimized for reliability and accuracy in advanced logic board rework
View full details