Tin mesh designed for precise reballing of iPhone 12 Pro Max logic board solder pads
Restores damaged or missing pad structures during IC and multilayer board repair
Ensures accurate alignment and consistent solder distribution across reworked areas
Ideal for CPU, PMIC and mid-layer module reballing on the iPhone 12 Pro Max
High-temperature resistant mesh suitable for professional microsoldering workflows
YCS mesh engineered for reliability and accuracy in board-level rework
