Tin mesh designed for precise reballing of iPhone 13 Pro Max logic board solder pads
Restores damaged or missing pad structures during multilayer and IC-level repair
Ensures accurate alignment and uniform solder distribution across reworked sections
Ideal for CPU, PMIC and mid-layer component reballing on the iPhone 13 Pro Max
High-temperature resistant mesh suitable for professional microsoldering tasks
YCS mesh engineered for consistency, accuracy and durability in board-level rework
Designed specifically for Promax Mid-layer General-purpose Tin Planting Platform For iPhone 13 Series (YCS).
Provides reliable performance and long-lasting durability.
Made using premium quality materials for better protection.
Easy to install with precise fitting and alignment.
