Tin mesh designed for accurate reballing of iPhone 14 Pro and 14 Pro Max logic board solder pads
Ensures precise restoration of pad structures during middle-layer and IC rework
Improves alignment and consistency for CPU, PMIC and multilayer module repairs
High-temperature resistant mesh suitable for professional microsoldering work
Optimized for restoring missing or damaged solder points across internal board layers
YCS mesh engineered for stable, reliable performance in advanced board-level repair
