Mid-layer solder mesh designed for precise reballing of iPhone 15 and 15 Plus multilayer logic boards
Restores internal solder pad structures damaged during IC or middle-layer repair
Ensures accurate alignment and consistent solder distribution across mid-layer sections
Ideal for CPU, PMIC and other multilayer IC module rework on the iPhone 15 lineup
High-temperature resistant mesh compatible with professional microsoldering workflows
YCS mesh engineered for accuracy and reliability in advanced board-level repairs
