Tin mesh designed for precise reballing of iPhone 11 Pro, 11 Pro Max and XS Max logic board solder pads
Restores damaged or missing pad structures during IC replacement and multilayer board repair
Ensures accurate alignment and consistent solder distribution across rebuilt sections
Ideal for CPU, PMIC and mid-layer module reballing on the listed iPhone models
High-temperature resistant mesh suitable for professional microsoldering workflows
YCS mesh engineered for accuracy, durability and stable performance in board-level rework
