3in1 precision reballing platform designed for iPhone 17, 17 Pro and 17 Pro Max middle frame IC work Securely holds frames and chips to maintain stability during reballing and high-precision soldering Machined structure ensures accurate alignment and consistent solder ball placement Ideal for CPU, PMIC and key component reballing on iPhone 17 series logic boards Heat-resistant and durable material optimized for repeated professional repair use Compatible with Qianli rework stations and standard microsoldering workflows
