The TR Middle Layer Frame Reballing Platform for iPhone X–17 Pro Max (XZZ) is a precision motherboard repair fixture designed for advanced board-level servicing.
It is used for reballing and aligning the middle layer (sandwich structure) of iPhone logic boards.
Supports a wide range of devices from iPhone X to iPhone 17 Pro Max, making it highly versatile.
Provides stable positioning to ensure accurate solder ball placement during reballing work.
Built with high-precision alignment design to minimize errors in motherboard repair.
Helps technicians safely hold and secure delicate PCB layers during heat and soldering processes.
Enhances efficiency and accuracy in IC rework, layer separation, and board reconstruction tasks.
Made from durable materials for long-term professional workshop use.
Compatible with advanced micro-soldering and board repair workflows.
A professional-grade reballing platform designed for precise and reliable iPhone motherboard restoration.
